Printed electronics, as a low-cost and green manufacturing technology, has been widely applied in fields such as flexible displays, photovoltaics, and sensors. In the development of printed flexible transparent conductive films, a key enabling material, China has established a globally leading industrial advantage based on technologies including silver nanowires. Meanwhile, printed additive manufacturing and smart packaging technologies are also driving industrial transformation and upgrading in China. Over the past five years, the Ministry of Science and Technology of China has repeatedly supported research projects related to printed displays, printed sensors, and flexible thin-film photovoltaic cells, highlighting the strategic importance of advancing printed electronics technologies.
Since 2010, China has successfully hosted 15 consecutive editions of the Flexible and Printed Electronics Symposium. In 2017, the symposium was officially integrated into the global FlexTech conference system led by the Semiconductor Equipment and Materials International (SEMI), and launched under the brand name“Flex China”. It has since become an important platform for communication and collaboration among academia, industry, and research institutions, significantly promoting industry–academia–research cooperation and innovation in the field of flexible electronics.
The 2026 Chinese Flexible and Printed Electronics Symposium (Flex China 2026) is a flagship event that integrates industry, academia, and research in the field of flexible and printed electronics in China. It is also one of the core branded conferences of CHInano 2026–The 16th China International Nanotechnology Industry Expo. The symposium will be held from October 21–22, 2026, at Suzhou International Expo Centre, under the theme of“Frontier Technologies of Flexible and Printed Electronics for Energy, Bioinformation, and Artificial Intelligence Applications”.The event will bring together experts, scholars, and industry leaders to explore new opportunities and future directions for the development of flexible and printed electronics.






