Biography: Li Xiaomin, Chairman of Wintech Nano, holds a Bachelor’s degree from Peking University and a Master’s degree from National University of Singapore. He has applied for numerous invention patents and published over 100 papers and co-authored two books.

In 2001, Li Xiaomin worked at the Agency for Science, Technology and Research (A*STAR) in Singapore. In 2004, he founded Wintech-Nano Technology Services Pte. Ltd. in Singapore, and in 2012, he established Wintech Nano (Suzhou) Co., Ltd. Under his leadership, the company has become a renowned platform for semiconductor chip analysis and testing services, as well as a crucial support center for R&D in the industry.

Abstract: The semiconductor industry has thousands of subdivisions, from the most upstream raw materials, equipment, chip design, manufacturing and packaging to module terminals and many other derivative industries. Semiconductor testing and analysis is an important link in the semiconductor industry chain, and testing and analysis services help accelerate the R&D process, improve product performance indicators and yield rates, and play an important role in the development of semiconductor technology and process evolution. From a unique perspective and combined with more than 20 years of experience, Mr. Li Xiaomin will share his pioneering "Labless" business concept from the requirements of semiconductor industry segmentation, the demand for equipment and talent pain points, the "value mutual trust theory" and the judgment of the analysis and testing track on the semiconductor industry cycle.

Biography:Professor Rong Yu of Tsinghua University graduated from Zhejiang University in 1996 and received his Ph.D. degree from Institute of Metals, Chinese Academy of Sciences in 2002. Before joining Tsinghua University in 2008, he worked as a postdoctoral researcher at Lawrence Berkeley National Laboratory and the University of Cambridge. He has been engaged in the research of electron microscopy and microstructure of materials. He invented adaptive-propagator ptychography, local-orbital ptychography, and local orbital tomography, and studied crystal structure and defects, electronic structure and magnetic structure of materials at the atomic scale, and carried out the research on rare earth permanent magnet materials. 

Abstract:The dimensions of semiconductor devices are getting smaller and the configurations are becoming more and more complex, posing new challenges to the spatial resolution of microstructural characterization. At the same time, the rapid development of computational electron microscopy based on big data has brought new opportunities for solving the structural analysis challenges of semiconductor devices. The most representative ones are electron ptychography and electron tomography. Recently, local orbital ptychography has pushed the information limit of microscopic imaging to 14 pm, and multi-section local orbital tomography has pushed the atomic-scale 3D reconstruction to the million-atom level, which is expected to realize accurate analysis of 3D atomic structure of semiconductor devices.

Biography:  Manager, Failure Analysis: More than 15 years of FA experience in IC Fab; Focused on both EFA & PFA;Sr. Application Specialist:Field application for Nanoprobing in China; Manager, EFA Sales Development & Application Engineers:Sales development for EFA product (Optical Fault Isolation, Lock-in Thermography, Nanoprobing, Circuit Edit) ; Customer interface and application support.

Abstract: This report is focusing on the failure analysis of semiconductor which includes the fundamental and application of FA technologies. By clarifying the workflow from fault isolation and physical verification, this report will point out the key factor of low success rate for regular problems in failure analysis with multiple case studies.In Semiconductor, Thermo Fisher Scientific integrated the total solution from EFA to PFA for customer. In this report, tool performance, limitation of analysis technology, application experience will be integrated to description for improving the success rate of failure analysis.

Biography:Dr. Feng Lin, Application Engineer, ULVAC-PHI Instruments Co., Ltd.. She received her PhD from the National Synchrotron Radiation Laboratory of the University of Science and Technology of China in 2020. She joined ULVAC-PHI Instruments Co., Ltd. In 2022, and was responsible for surface analysis testing and XPS analysis technology application training in PHI Nanjing Surface Analysis Lab. She has rich experience in the application of various surface analysis technologies such as XPS, UPS and AES.

Abstract:Surface analysis technology has been widely used in many scientific research and high-tech industries. In particular, the micro-XPS combined with AES can achieve accurate navigation and reliable analysis of micro-features in the failure analysis of micron/nanometer characteristics and complex materials/devices. This report will introduce the latest progress of surface analysis techniques (XPS and AES) from the dimensions of spatial resolution and depth resolution, as well as the comprehensive application in multidisciplinary fields, including the study of the spatial distribution and chemical states of micro-features of materials, the depth construction of thin films, and the failure analysis of materials/devices.

Biography:Dr. Kaichen Gu is a Senior Engineer at Exponent’s Hong Kong office, specializing in elucidating material-structure-function relationships for materials in electronics. He holds a Ph.D. in Chemical Engineering from Princeton University with a focus on the materials science.

Dr. Gu has worked on many different classes of materials and has extensive experience with various characterization techniques, including SEM/EDS, XRD, AFM, SEC, TGA and DSC. He frequently applies these characterization techniques to solve problems involving semiconductors, electronic packaging, displays, user interfaces, and electronic assemblies. Since joining Exponent, Dr. Gu has continuously worked with his clients in consumer electronics industry on various real-world failures, providing critical insights and solutions.

Abstract:In the rapidly evolving field of electronics, ensuring the reliability and longevity of products is paramount. Material science offers a suite of experimental techniques at various length scales that are invaluable for failure analysis in electronics. This talk will explore how methods such as Atomic Force Microscopy (AFM), Scanning Electron Microscopy (SEM), and Optical Microscopy (OM) provide detailed images of morphological and structural defects at the nanoscale, microscale, and mesoscale, respectively, which may ultimately affect the macroscopic properties of the samples. At specific scales of interest, non-destructive techniques like X-ray Computed Tomography (CT) and destructive techniques such as Focused Ion Beam (FIB) can be applied to locate and characterize damage features. By integrating these techniques, we can pinpoint the root causes of failures and enhance the reliability and performance of electronic products, driving innovation and consumer satisfaction. Case studies will be presented to illustrate the practical application of these techniques in real-world scenarios.

Biography:Graduated from PKU-IME in 1998. Served as director of Liquid-Crystal-Display Module Institute and Display R&D director of Qingdao Hisense Electric Co., Ltd. Team Leader of the first LED backlight unit LCD-TV-set and the first Quantum-Dot LCD-TV-set in China. Won the IEC1906 Award in 2020.

Abstract:Analyze the elements and survey results of the evaluation architecture for third-party semiconductor failure analysis and testing service providers, and propose the idea of establishing an evaluation standard system and technical standard system under the guidance of the Labless model.

Biography:

■Current Position:

Deputy Director, Global Sales Planning Department at Hitachi High-Tech Corporation

■Education:

 Graduated from Shibaura Institute of Technology with a degree in Electronic Engineering

■Career History:

2006-2023: Toshiba Nanoanalysis Corporation

Role: Responsible for semiconductor physical analysis

Achievement: Played a key role in launching the company’s nanoprobe business

2024-Present: Hitachi High-Tech Corporation

Role: Involved in marketing nanoprobing systems

Abstract:

The advanced nanoscale device characteristics analysis system NP8000 was developed with a focus on strengthening two key technologies: nanoprobing for microscopic areas and electron beam absorbed current (EBAC) observation. It enables probing at extremely low accelerating voltages to suppress fluctuations in device characteristics due to electron beam irradiation, and high-current observation, which is effective for effectively capturing signals at defective locations. In addition, the performance of voltage-applied EBAC (DI-EBAC) has been further enhanced by improving the amplifier to capture reactions of failure modes that could not be captured before.

Biography:Chunjie Cao (Jason Cao) is an X-ray microscopy technical expert at Carl Zeiss (Shanghai) Management Co., Ltd. He has been engaged in X-ray microscope imaging technology for 12 years at ZEISS and is proficient in the application of X-ray microscopes in high-end industrial inspection and scientific research. He has provided failure analysis and detection solutions and technical support for dozens of well-known electronic semiconductor companies at home and abroad, and helped scientific researchers publish more than 50 papers in internationally renowned academic journals such as Nature, Science, PNAS, Advance Science, etc. through experiments.

Abstract:The report will cover the following three aspects:

(1) Progress in advanced semiconductor packaging and failure analysis and detection methods

(2) X-ray microscope imaging principles and technical characteristics

(3) The application of X-ray microscopy in the field of failure analysis of electronic semiconductors

The report will explain the progress of failure analysis instruments and analysis methods in combination with the development trend of advanced semiconductor packaging. Through the introduction of the X-ray microscopy imaging principle, the reasons why this technique is suitable for failure analysis are analyzed. The report will also illustrate the imaging of different types of semiconductor samples and failure analysis solutions based on X-ray microscopy and FIB-SEM combined. Through this sharing, we try to provide some failure analysis methods and ideas for coworkers in the electronic semiconductor industry.